Part Details for 74HC365PW-Q100,118 by NXP Semiconductors
Overview of 74HC365PW-Q100,118 by NXP Semiconductors
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Part Details for 74HC365PW-Q100,118
74HC365PW-Q100,118 CAD Models
74HC365PW-Q100,118 Part Data Attributes
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74HC365PW-Q100,118
NXP Semiconductors
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Datasheet
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74HC365PW-Q100,118
NXP Semiconductors
74HC(T)365-Q100 - Hex buffer/line driver; 3-state TSSOP 16-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | TSSOP | |
| Package Description | 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | SOT403-1 | |
| Reach Compliance Code | compliant | |
| Control Type | ENABLE LOW | |
| Family | HC/UH | |
| JESD-30 Code | R-PDSO-G16 | |
| Length | 5 mm | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | BUS DRIVER | |
| Max I(ol) | 0.006 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 6 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP16,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 29 ns | |
| Propagation Delay (tpd) | 145 ns | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 6 V | |
| Supply Voltage-Min (Vsup) | 2 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4.4 mm |