Part Details for 74AUP1G57GS,132 by NXP Semiconductors
Results Overview of 74AUP1G57GS,132 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Automotive
74AUP1G57GS,132 Information
74AUP1G57GS,132 by NXP Semiconductors is an Other Logic IC.
Other Logic ICs are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for 74AUP1G57GS,132
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | 74AUP1G57GS - Logic Circuit RoHS: Compliant Status: Active Min Qty: 1 | 90000 |
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$0.0768 / $0.0904 | Buy Now |
Part Details for 74AUP1G57GS,132
74AUP1G57GS,132 CAD Models
74AUP1G57GS,132 Part Data Attributes
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74AUP1G57GS,132
NXP Semiconductors
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Datasheet
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74AUP1G57GS,132
NXP Semiconductors
74AUP1G57 - Low-power configurable multiple function gate
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 | |
| Manufacturer Package Code | SOT1202 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 4 Weeks | |
| Family | AUP/ULP/V | |
| JESD-30 Code | S-PDSO-N6 | |
| JESD-609 Code | e3 | |
| Length | 1 mm | |
| Load Capacitance (CL) | 30 pF | |
| Logic IC Type | LOGIC CIRCUIT | |
| Max I(ol) | 0.0017 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSON | |
| Package Equivalence Code | SOLCC6,.04,14 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 22.3 ns | |
| Qualification Status | Not Qualified | |
| Schmitt Trigger | YES | |
| Seated Height-Max | 0.35 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 0.8 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.35 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1 mm |