Part Details for 74ALVC16244DGG,112 by NXP Semiconductors
Overview of 74ALVC16244DGG,112 by NXP Semiconductors
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Entertainment and Gaming
Part Details for 74ALVC16244DGG,112
74ALVC16244DGG,112 CAD Models
74ALVC16244DGG,112 Part Data Attributes:
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74ALVC16244DGG,112
NXP Semiconductors
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74ALVC16244DGG,112
NXP Semiconductors
74ALVC(H)16244 - 2.5 V / 3.3 V 16-bit buffer/line driver (3-State) TSSOP 48-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSSOP | |
Package Description | 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48 | |
Pin Count | 48 | |
Manufacturer Package Code | SOT362-1 | |
Reach Compliance Code | compliant | |
Control Type | ENABLE LOW | |
Family | ALVC/VCX/A | |
JESD-30 Code | R-PDSO-G48 | |
JESD-609 Code | e4 | |
Length | 12.5 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | BUS DRIVER | |
Max I(ol) | 0.024 A | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 4 | |
Number of Functions | 4 | |
Number of Ports | 2 | |
Number of Terminals | 48 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP48,.3,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 3 ns | |
Propagation Delay (tpd) | 5.1 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 1.2 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6.1 mm |