Part Details for 74AHC244BQ-Q100,11 by NXP Semiconductors
Overview of 74AHC244BQ-Q100,11 by NXP Semiconductors
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Part Details for 74AHC244BQ-Q100,11
74AHC244BQ-Q100,11 CAD Models
74AHC244BQ-Q100,11 Part Data Attributes:
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74AHC244BQ-Q100,11
NXP Semiconductors
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74AHC244BQ-Q100,11
NXP Semiconductors
74AHC(T)244-Q100 - Octal buffer/line driver; 3-state QFN 20-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 | |
Pin Count | 20 | |
Manufacturer Package Code | SOT764-1 | |
Reach Compliance Code | compliant | |
Control Type | ENABLE LOW | |
Family | AHC/VHC/H/U/V | |
JESD-30 Code | R-PQCC-N20 | |
Length | 4.5 mm | |
Logic IC Type | BUS DRIVER | |
Max I(ol) | 0.008 A | |
Number of Bits | 4 | |
Number of Functions | 2 | |
Number of Ports | 2 | |
Number of Terminals | 20 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC20,.1X.18,20 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Prop. Delay@Nom-Sup | 9.5 ns | |
Propagation Delay (tpd) | 15 ns | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 2.5 mm |