Part Details for 74AC125TELL-E by Renesas Electronics Corporation
Overview of 74AC125TELL-E by Renesas Electronics Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for 74AC125TELL-E
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
2156-74AC125TELL-E-ND
|
DigiKey | QUAD BUFFER/LINE DRIVER Min Qty: 235 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
2000 In Stock |
|
$1.2800 | Buy Now |
|
Rochester Electronics | 74AC125 Quad buffer/Line Driver with 3-State Outputs ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 2000 |
|
$1.0900 / $1.2900 | Buy Now |
Part Details for 74AC125TELL-E
74AC125TELL-E CAD Models
74AC125TELL-E Part Data Attributes
|
74AC125TELL-E
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
74AC125TELL-E
Renesas Electronics Corporation
HD74AC Series, , /
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Manufacturer Package Code | PTSP0014JA | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Renesas Electronics | |
Control Type | ENABLE LOW | |
JESD-30 Code | R-PDSO-G14 | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | BUS DRIVER | |
Max I(ol) | 0.012 A | |
Number of Bits | 4 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 14 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP14,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Prop. Delay@Nom-Sup | 10 ns | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.635 mm | |
Terminal Position | DUAL |