Part Details for 74LVTH16245BDGG,11 by NXP Semiconductors
Overview of 74LVTH16245BDGG,11 by NXP Semiconductors
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Part Details for 74LVTH16245BDGG,11
74LVTH16245BDGG,11 CAD Models
74LVTH16245BDGG,11 Part Data Attributes
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74LVTH16245BDGG,11
NXP Semiconductors
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74LVTH16245BDGG,11
NXP Semiconductors
74LVT16245B; 74LVTH16245B - 3.3 V 16-bit transceiver; 3-state TSSOP 48-Pin
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSSOP | |
Package Description | TSSOP, TSSOP48,.3,20 | |
Pin Count | 48 | |
Manufacturer Package Code | SOT362-1 | |
Reach Compliance Code | compliant | |
Control Type | COMMON CONTROL | |
Count Direction | BIDIRECTIONAL | |
Family | LVT | |
JESD-30 Code | R-PDSO-G48 | |
JESD-609 Code | e3 | |
Length | 12.5 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | BUS TRANSCEIVER | |
Max I(ol) | 0.064 A | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 8 | |
Number of Functions | 2 | |
Number of Ports | 2 | |
Number of Terminals | 48 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP48,.3,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TAPE AND REEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Power Supplies | 3.3 V | |
Prop. Delay@Nom-Sup | 3.3 ns | |
Propagation Delay (tpd) | 3.5 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Translation | N/A | |
Width | 6.1 mm |