Part Details for 74LVC157ABQ-Q100X by NXP Semiconductors
Overview of 74LVC157ABQ-Q100X by NXP Semiconductors
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Part Details for 74LVC157ABQ-Q100X
74LVC157ABQ-Q100X CAD Models
74LVC157ABQ-Q100X Part Data Attributes
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74LVC157ABQ-Q100X
NXP Semiconductors
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74LVC157ABQ-Q100X
NXP Semiconductors
74LVC157A-Q100 - Quad 2-input multiplexer QFN 16-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | SOT763-1 | |
| Reach Compliance Code | compliant | |
| Family | LVC/LCX/Z | |
| JESD-30 Code | R-PQCC-N16 | |
| Length | 3.5 mm | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | MULTIPLEXER | |
| Max I(ol) | 0.024 A | |
| Number of Functions | 4 | |
| Number of Inputs | 2 | |
| Number of Outputs | 1 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC16,.1X.14,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Packing Method | TR | |
| Prop. Delay@Nom-Sup | 6.5 ns | |
| Propagation Delay (tpd) | 11.8 ns | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.2 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 2.5 mm |