Part Details for 72V263L6BCG8 by Integrated Device Technology Inc
Overview of 72V263L6BCG8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 72V263L6BCG8 | Renesas Electronics Corporation | 8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V |
Part Details for 72V263L6BCG8
72V263L6BCG8 CAD Models
72V263L6BCG8 Part Data Attributes
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72V263L6BCG8
Integrated Device Technology Inc
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Datasheet
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72V263L6BCG8
Integrated Device Technology Inc
CABGA-100, Reel
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CABGA | |
| Package Description | 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | BCG100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 4 ns | |
| Additional Feature | IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE | |
| Cycle Time | 6 ns | |
| JESD-30 Code | S-PBGA-B100 | |
| JESD-609 Code | e1 | |
| Length | 11 mm | |
| Memory Density | 147456 bit | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8KX18 | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max (Vsup) | 3.45 V | |
| Supply Voltage-Min (Vsup) | 3.15 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm |
Alternate Parts for 72V263L6BCG8
This table gives cross-reference parts and alternative options found for 72V263L6BCG8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 72V263L6BCG8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT72V263L6BCG | FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | Integrated Device Technology Inc | 72V263L6BCG8 vs IDT72V263L6BCG |
| IDT72V263L6BC | FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100 | Integrated Device Technology Inc | 72V263L6BCG8 vs IDT72V263L6BC |
| 72V263L6BC | 8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray | Renesas Electronics Corporation | 72V263L6BCG8 vs 72V263L6BC |
| 72V263L6BCG | 8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray | Renesas Electronics Corporation | 72V263L6BCG8 vs 72V263L6BCG |
| 72V263L6BCG8 | 8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V, CABGA0/Reel | Renesas Electronics Corporation | 72V263L6BCG8 vs 72V263L6BCG8 |
| 72V263L6BCG | CABGA-100, Tray | Integrated Device Technology Inc | 72V263L6BCG8 vs 72V263L6BCG |