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Part Details for 72V223L7-5BCI by Renesas Electronics Corporation
Overview of 72V223L7-5BCI by Renesas Electronics Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Renewable Energy
Automotive
Price & Stock for 72V223L7-5BCI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
72V223L7-5BCI
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Avnet Americas | 512 x 18 / 1K x 9 SuperSync II FIFO, 3.3V - Trays (Alt: 72V223L7-5BCI) RoHS: Not Compliant Min Qty: 21 Package Multiple: 1 Container: Tray | 0 |
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RFQ |
Part Details for 72V223L7-5BCI
72V223L7-5BCI CAD Models
72V223L7-5BCI Part Data Attributes
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72V223L7-5BCI
Renesas Electronics Corporation
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Datasheet
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72V223L7-5BCI
Renesas Electronics Corporation
512 x 18 / 1K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | CABGA | |
| Package Description | 11 X 11 MM, 1 MM PITCH, BGA-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | BC100 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320071 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 5 ns | |
| Additional Feature | IT CAN ALSO BE CONFIGURED AS 1K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE | |
| Alternate Memory Width | 9 | |
| Clock Frequency-Max (fCLK) | 133.3 MHz | |
| Cycle Time | 7.5 ns | |
| JESD-30 Code | S-PBGA-B100 | |
| JESD-609 Code | e0 | |
| Length | 11 mm | |
| Memory Density | 9216 bit | |
| Memory IC Type | OTHER FIFO | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512X18 | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA100,10X10,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Standby Current-Max | 0.015 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.45 V | |
| Supply Voltage-Min (Vsup) | 3.15 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 11 mm |