Datasheets
72V02L15JG by:
Integrated Device Technology Inc
Integrated Device Technology Inc
Renesas Electronics Corporation
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PLCC-32, Tube

Part Details for 72V02L15JG by Integrated Device Technology Inc

Results Overview of 72V02L15JG by Integrated Device Technology Inc

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72V02L15JG Information

72V02L15JG by Integrated Device Technology Inc is an FIFO.
FIFOs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for 72V02L15JG

Part # Distributor Description Stock Price Buy
Vyrian Memory ICs 278
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Part Details for 72V02L15JG

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72V02L15JG Part Data Attributes

72V02L15JG Integrated Device Technology Inc
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72V02L15JG Integrated Device Technology Inc PLCC-32, Tube
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PLCC
Package Description LCC-32
Pin Count 32
Manufacturer Package Code PLG32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Date Of Intro 1988-01-01
Access Time-Max 15 ns
Cycle Time 25 ns
JESD-30 Code R-PQCC-N32
JESD-609 Code e3
Length 13.97 mm
Memory Density 9216 bit
Memory IC Type OTHER FIFO
Memory Width 9
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 32
Number of Words 1024 words
Number of Words Code 1000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1KX9
Output Characteristics 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY
Package Code QCCN
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.79 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 11.43 mm

72V02L15JG Related Parts

72V02L15JG Frequently Asked Questions (FAQ)

  • A good PCB layout for the 72V02L15JG should prioritize signal integrity, minimize noise, and ensure proper power distribution. Use a 4-layer board with a solid ground plane, keep signal traces short and away from power planes, and use decoupling capacitors near the device.

  • To ensure reliable operation in high-temperature environments, follow the recommended operating temperature range (typically -40°C to 85°C), use a heat sink if necessary, and ensure good airflow around the device. Also, consider derating the device's performance and power consumption according to the datasheet.

  • When using the 72V02L15JG in a system with multiple power domains, ensure that the device is properly isolated from other power domains using level shifters, voltage translators, or optocouplers. Also, consider the impact of power sequencing and voltage ramp rates on the device's operation.

  • To troubleshoot issues with the 72V02L15JG, start by reviewing the datasheet and application notes, then check the PCB layout, power supply, and signal integrity. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the root cause of the issue. Consult with IDT support or a qualified engineer if necessary.

  • Yes, the 72V02L15JG is a high-speed device that can be susceptible to EMI/EMC issues. Follow good design practices for EMI/EMC mitigation, such as using shielding, filtering, and grounding techniques. Ensure that the device is properly decoupled and that signal traces are routed away from noise sources.