Part Details for 72V02L15JG by Integrated Device Technology Inc
Results Overview of 72V02L15JG by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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72V02L15JG Information
72V02L15JG by Integrated Device Technology Inc is an FIFO.
FIFOs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for 72V02L15JG
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Memory ICs | 278 |
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RFQ |
Part Details for 72V02L15JG
72V02L15JG CAD Models
72V02L15JG Part Data Attributes
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72V02L15JG
Integrated Device Technology Inc
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Datasheet
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72V02L15JG
Integrated Device Technology Inc
PLCC-32, Tube
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | PLCC | |
Package Description | LCC-32 | |
Pin Count | 32 | |
Manufacturer Package Code | PLG32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Date Of Intro | 1988-01-01 | |
Access Time-Max | 15 ns | |
Cycle Time | 25 ns | |
JESD-30 Code | R-PQCC-N32 | |
JESD-609 Code | e3 | |
Length | 13.97 mm | |
Memory Density | 9216 bit | |
Memory IC Type | OTHER FIFO | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 1024 words | |
Number of Words Code | 1000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1KX9 | |
Output Characteristics | 3-STATE | |
Output Enable | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCN | |
Package Equivalence Code | LCC32,.45X.55 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.79 mm | |
Standby Current-Max | 0.005 A | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 11.43 mm |