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4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
72V253L7-5BCI | Renesas Electronics Corporation | 4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V | |
72V253L7-5PFGI8 | Renesas Electronics Corporation | 4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V | |
72V253L7-5PFI | Renesas Electronics Corporation | 4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V |
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72V253L7-5BCI
Renesas Electronics Corporation
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Datasheet
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72V253L7-5BCI
Renesas Electronics Corporation
4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Package Description | 11 X 11 MM, 1 MM PITCH, BGA-100 | |
Pin Count | 100 | |
Manufacturer Package Code | BC100 | |
Reach Compliance Code | not_compliant | |
ECCN Code | NLR | |
HTS Code | 8542320071 | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 5 ns | |
Additional Feature | IT CAN ALSO BE CONFIGURED AS 8K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE | |
Alternate Memory Width | 9 | |
Clock Frequency-Max (fCLK) | 133.3 MHz | |
Cycle Time | 7.5 ns | |
JESD-30 Code | S-PBGA-B100 | |
JESD-609 Code | e0 | |
Length | 11 mm | |
Memory Density | 73728 bit | |
Memory IC Type | OTHER FIFO | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4KX18 | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA100,10X10,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Standby Current-Max | 0.015 A | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 3.45 V | |
Supply Voltage-Min (Vsup) | 3.15 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 11 mm |
This table gives cross-reference parts and alternative options found for 72V253L7-5BCI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 72V253L7-5BCI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
IDT72V253L7-5BCG | Integrated Device Technology Inc | Check for Price | FIFO, 4KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | 72V253L7-5BCI vs IDT72V253L7-5BCG |
IDT72V253L7-5BCI | Integrated Device Technology Inc | Check for Price | FIFO, 4KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100 | 72V253L7-5BCI vs IDT72V253L7-5BCI |
72V253L7-5BCG | Integrated Device Technology Inc | Check for Price | FIFO, 4KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | 72V253L7-5BCI vs 72V253L7-5BCG |