Part Details for 72T36135ML6BBI by Integrated Device Technology Inc
Overview of 72T36135ML6BBI by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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72T36135ML6BBI | Renesas Electronics Corporation | 512K x 36 TeraSync FIFO, 2.5V |
Part Details for 72T36135ML6BBI
72T36135ML6BBI CAD Models
72T36135ML6BBI Part Data Attributes
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72T36135ML6BBI
Integrated Device Technology Inc
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Datasheet
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72T36135ML6BBI
Integrated Device Technology Inc
PBGA-240, Tray
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | PBGA | |
Package Description | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | |
Pin Count | 240 | |
Manufacturer Package Code | BB240 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 3.8 ns | |
Clock Frequency-Max (fCLK) | 166 MHz | |
Cycle Time | 6 ns | |
JESD-30 Code | S-PBGA-B240 | |
JESD-609 Code | e0 | |
Length | 19 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | OTHER FIFO | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 240 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX36 | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA240,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.76 mm | |
Standby Current-Max | 0.14 A | |
Supply Current-Max | 0.18 mA | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 19 mm |
Alternate Parts for 72T36135ML6BBI
This table gives cross-reference parts and alternative options found for 72T36135ML6BBI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 72T36135ML6BBI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
72T36135ML6BBG | FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240 | Renesas Electronics Corporation | 72T36135ML6BBI vs 72T36135ML6BBG |
72T36135ML6BBGI | FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240 | Renesas Electronics Corporation | 72T36135ML6BBI vs 72T36135ML6BBGI |
IDT72T36135ML6BBG | FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 | Integrated Device Technology Inc | 72T36135ML6BBI vs IDT72T36135ML6BBG |
72T36135ML6BBGI | FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 | Integrated Device Technology Inc | 72T36135ML6BBI vs 72T36135ML6BBGI |