| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 71V65703S80BQI8 | Renesas Electronics Corporation | 3.3V 256K x 36 ZBT Synchronous 3.3V I/O Flowthrough SRAM |
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
CABGA
|
|
Pin Count
|
165
|
|
Manufacturer Package Code
|
BQ165
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
NLR
|
|
HTS Code
|
8542320041
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
8 ns
|
|
Additional Feature
|
FLOW-THROUGH ARCHITECTURE
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e0
|
|
Length
|
15 mm
|
|
Memory Density
|
9437184 bit
|
|
Memory IC Type
|
ZBT SRAM
|
|
Memory Width
|
36
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
262144 words
|
|
Number of Words Code
|
256000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
256KX36
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
225
|
|
Seated Height-Max
|
1.2 mm
|
|
Supply Voltage-Max (Vsup)
|
3.465 V
|
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
13 mm
|
