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Overview of 71V632S4PF by Integrated Device Technology Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for 71V632S4PF by Integrated Device Technology Inc
Part Data Attributes for 71V632S4PF by Integrated Device Technology Inc
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Rohs Code
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No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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INTEGRATED DEVICE TECHNOLOGY INC
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Reach Compliance Code
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not_compliant
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ECCN Code
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3A991.B.2.A
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HTS Code
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8542.32.00.41
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Date Of Intro
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1996-07-01
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Access Time-Max
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4 ns
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Clock Frequency-Max (fCLK)
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133 MHz
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I/O Type
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COMMON
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JESD-30 Code
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R-PQFP-G100
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JESD-609 Code
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e0
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Memory Density
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2097152 bit
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Memory IC Type
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STANDARD SRAM
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Memory Width
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32
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Moisture Sensitivity Level
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3
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Number of Terminals
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100
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Number of Words
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65536 words
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Number of Words Code
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64000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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64KX32
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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QFP
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Package Equivalence Code
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QFP100,.63X.87
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Package Shape
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RECTANGULAR
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Package Style
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FLATPACK
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Parallel/Serial
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PARALLEL
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Peak Reflow Temperature (Cel)
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225
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Qualification Status
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Not Qualified
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Standby Current-Max
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0.009 A
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Standby Voltage-Min
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3.14 V
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Supply Current-Max
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0.24 mA
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Supply Voltage-Nom (Vsup)
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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TIN LEAD
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Terminal Form
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GULL WING
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Terminal Pitch
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0.635 mm
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Terminal Position
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QUAD
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Time@Peak Reflow Temperature-Max (s)
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20
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