| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
71V3577S80BQ8
|
Avnet Americas | 3.3V 128K x 36 Synchronous Flow-Through SRAM w/3.3V I/O - Tape and Reel (Alt: 71V3577S80BQ8) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Container: Reel | 0 |
|
RFQ | ||
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Lead time: 36 Weeks Container: Reel | 0Reel |
|
$6.3700 | Buy Now | ||
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Lead time: 36 Weeks Container: Reel | 0Reel |
|
$6.3700 | Buy Now |
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
End Of Life
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
CABGA
|
|
Package Description
|
CABGA-165
|
|
Pin Count
|
165
|
|
Manufacturer Package Code
|
BQ165
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
NLR
|
|
HTS Code
|
8542320041
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
8 ns
|
|
Additional Feature
|
FLOW THROUGH ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
100 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e0
|
|
Length
|
15 mm
|
|
Memory Density
|
4718592 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
36
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Ports
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
128KX36
|
|
Output Characteristics
|
3-STATE
|
|
Output Enable
|
YES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TBGA
|
|
Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
225
|
|
Qualification Status
|
Not Qualified
|
|
Reverse Pinout
|
NO
|
|
Seated Height-Max
|
1.2 mm
|
|
Standby Current-Max
|
0.03 A
|
|
Standby Voltage-Min
|
3.14 V
|
|
Supply Current-Max
|
0.2 mA
|
|
Supply Voltage-Max (Vsup)
|
3.465 V
|
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
13 mm
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 71V2577S80BQ | CABGA-165, Tray | Integrated Device Technology Inc | 71V3577S80BQ8 vs 71V2577S80BQ |
| IDT71V2577S80BQ | Cache SRAM, 128KX36, 8ns, CMOS, PBGA165, FBGA-165 | Integrated Device Technology Inc | 71V3577S80BQ8 vs IDT71V2577S80BQ |
| IDT71V3577S80BQ8 | Cache SRAM, 128KX36, 8ns, CMOS, PBGA165, FBGA-165 | Integrated Device Technology Inc | 71V3577S80BQ8 vs IDT71V3577S80BQ8 |
| IDT71V3577S80BQ | Cache SRAM, 128KX36, 8ns, CMOS, PBGA165, FBGA-165 | Integrated Device Technology Inc | 71V3577S80BQ8 vs IDT71V3577S80BQ |
| 71V3577S80BQ | 3.3V 128K x 36 Synchronous Flow-Through SRAM w/3.3V I/O, CABGA136/Tray | Renesas Electronics Corporation | 71V3577S80BQ8 vs 71V3577S80BQ |
| 71V3577S80BQ8 | CABGA-165, Reel | Integrated Device Technology Inc | 71V3577S80BQ8 vs 71V3577S80BQ8 |
