Part Details for 71V3558S200PF by Integrated Device Technology Inc
Overview of 71V3558S200PF by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 71V3558S200PFG8 | Renesas Electronics Corporation | 3.3V 256K x 18 ZBT Synchronous PipeLined SRAM w/3.3V I/O | |
| 71V3558S200PFG | Renesas Electronics Corporation | 3.3V 256K x 18 ZBT Synchronous PipeLined SRAM w/3.3V I/O |
Price & Stock for 71V3558S200PF
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Rochester Electronics | 71V3558 - 256K X 18 3.3V Synchronous ZBT SRAM 3.3V I/O, Burst Counter Pipelined Outputs ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 19 |
|
$1.7800 / $2.0900 | Buy Now |
Part Details for 71V3558S200PF
71V3558S200PF CAD Models
71V3558S200PF Part Data Attributes
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71V3558S200PF
Integrated Device Technology Inc
Buy Now
Datasheet
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Compare Parts:
71V3558S200PF
Integrated Device Technology Inc
ZBT SRAM, 256KX18, 3.2ns, CMOS, PQFP100
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.2 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Memory Density | 4718592 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 100 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.63X.87 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.04 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.4 mA | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 20 |