Datasheets
71P72604S167BQG by: Integrated Device Technology Inc

CABGA-165, Tray

Part Details for 71P72604S167BQG by Integrated Device Technology Inc

Overview of 71P72604S167BQG by Integrated Device Technology Inc

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
71P72604S167BQGI Renesas Electronics Corporation QDRII BURST OF 2 X36
71P72604S167BQG Renesas Electronics Corporation QDRII BURST OF 2 X36
71P72604S167BQG8 Renesas Electronics Corporation QDRII BURST OF 2 X36

Price & Stock for 71P72604S167BQG

Part # Distributor Description Stock Price Buy
DISTI # 2156-71P72604S167BQG-ND
DigiKey IC SRAM 18MBIT PAR 165CABGA Min Qty: 42 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 127
In Stock
  • 42 $7.2400
$7.2400 Buy Now
Rochester Electronics 71P72604 - 18Mbit Pipelined QDRII SRAM Burst Of 2 ' RoHS: Compliant Status: Obsolete Min Qty: 1 127
  • 1 $6.9600
  • 25 $6.8200
  • 100 $6.5400
  • 500 $6.2600
  • 1,000 $5.9200
$5.9200 / $6.9600 Buy Now

Part Details for 71P72604S167BQG

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71P72604S167BQG Part Data Attributes

71P72604S167BQG Integrated Device Technology Inc
Buy Now Datasheet
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71P72604S167BQG Integrated Device Technology Inc CABGA-165, Tray
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA
Package Description 13 X 15 MM, GREEN, FPBGA-165
Pin Count 165
Manufacturer Package Code BQG165
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.5 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 18874368 bit
Memory IC Type QDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm

Alternate Parts for 71P72604S167BQG

This table gives cross-reference parts and alternative options found for 71P72604S167BQG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71P72604S167BQG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IDT71P72604S167BQ QDR SRAM, 512KX36, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 Integrated Device Technology Inc 71P72604S167BQG vs IDT71P72604S167BQ
71P72604S167BQ CABGA-165, Tray Integrated Device Technology Inc 71P72604S167BQG vs 71P72604S167BQ
Part Number Description Manufacturer Compare
IDT71P72604S167BQ QDR SRAM, 512KX36, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 Integrated Device Technology Inc 71P72604S167BQG vs IDT71P72604S167BQ
71P72604S167BQ CABGA-165, Tray Integrated Device Technology Inc 71P72604S167BQG vs 71P72604S167BQ

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