Part Details for 71V67603S133BGG8 by Integrated Device Technology Inc
Overview of 71V67603S133BGG8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 71V67603S133BGG8 | Renesas Electronics Corporation | 3.3V 256K x 36 Synchronous 3.3V I/O PipeLined SRAM |
Part Details for 71V67603S133BGG8
71V67603S133BGG8 CAD Models
71V67603S133BGG8 Part Data Attributes
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71V67603S133BGG8
Integrated Device Technology Inc
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Datasheet
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71V67603S133BGG8
Integrated Device Technology Inc
PBGA-119, Reel
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | PBGA | |
| Package Description | 14 X 22 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 | |
| Pin Count | 119 | |
| Manufacturer Package Code | BGG119 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Date Of Intro | 1997-09-16 | |
| Access Time-Max | 4.2 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.36 mm | |
| Standby Current-Max | 0.05 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.26 mA | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm |
Alternate Parts for 71V67603S133BGG8
This table gives cross-reference parts and alternative options found for 71V67603S133BGG8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71V67603S133BGG8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 71V67603ZS133BG | Integrated Device Technology Inc | Check for Price | Standard SRAM, 256KX36, 4.2ns, CMOS, PBGA119 | 71V67603S133BGG8 vs 71V67603ZS133BG |
| 71V67603ZS133BGG | Integrated Device Technology Inc | Check for Price | Standard SRAM, 256KX36, 4.2ns, CMOS, PBGA119 | 71V67603S133BGG8 vs 71V67603ZS133BGG |