| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 71V416L10BEG | Renesas Electronics Corporation | 3.3V 256K x 16 Asynchronous Static RAM Center Pwr & Gnd Pinout | |
| 71V416L10BEG8 | Renesas Electronics Corporation | 3.3V 256K x 16 Asynchronous Static RAM Center Pwr & Gnd Pinout | |
| 71V416L10BE | Renesas Electronics Corporation | 3.3V 256K x 16 Asynchronous Static RAM Center Pwr & Gnd Pinout |
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
71V416L10BE-ND
|
DigiKey | IC SRAM 4MBIT PARALLEL 48CABGA Min Qty: 250 Lead time: 36 Weeks Container: Tray |
250 In Stock |
|
$7.4326 | Buy Now | |
|
DISTI #
71V416L10BE
|
Avnet Americas | 3.3V 256K x 16 Asynchronous Static RAM Center Pwr & Gnd Pinout - Trays (Alt: 71V416L10BE) RoHS: Not Compliant Min Qty: 52 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 406 Partner Stock |
|
$6.1488 / $7.3200 | Buy Now | |
| Renesas Electronics America | IC SRAM 4MBIT PARALLEL 48CABGA Min Qty: 250 Container: Tray | 250 |
|
$7.4326 | Buy Now |
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
CABGA
|
|
Pin Count
|
48
|
|
Manufacturer Package Code
|
BE48
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
NLR
|
|
HTS Code
|
8542320041
|
|
Factory Lead Time
|
4 Weeks
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
10 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
S-PBGA-B48
|
|
JESD-609 Code
|
e0
|
|
Length
|
9 mm
|
|
Memory Density
|
4194304 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
16
|
|
Moisture Sensitivity Level
|
4
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
48
|
|
Number of Words
|
262144 words
|
|
Number of Words Code
|
256000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
256KX16
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TFBGA
|
|
Package Equivalence Code
|
BGA48,6X8,30
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
225
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.2 mm
|
|
Standby Current-Max
|
0.01 A
|
|
Standby Voltage-Min
|
3 V
|
|
Supply Current-Max
|
0.18 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
3 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.75 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
9 mm
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 71V416L10BEG | 3.3V 256K x 16 Asynchronous Static RAM Center Pwr & Gnd Pinout, CABGA250/Tray | Renesas Electronics Corporation | 71V416L10BE vs 71V416L10BEG |
