Part Details for 71V35761S183PF9 by Integrated Device Technology Inc
Overview of 71V35761S183PF9 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 71V35761S183PF9
71V35761S183PF9 CAD Models
71V35761S183PF9 Part Data Attributes
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71V35761S183PF9
Integrated Device Technology Inc
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Datasheet
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71V35761S183PF9
Integrated Device Technology Inc
Cache SRAM, 128KX36, 3.3ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | QFP | |
| Package Description | LQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.3 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Length | 20 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |
Alternate Parts for 71V35761S183PF9
This table gives cross-reference parts and alternative options found for 71V35761S183PF9. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71V35761S183PF9, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 71V35761S183PFI9 | Cache SRAM, 128KX36, 3.3ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S183PF9 vs 71V35761S183PFI9 |
| IDT71V35761S183PFG8 | Cache SRAM, 128KX36, 3.3ns, CMOS, PQFP100, 14 X 20 MM, GREEN, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S183PF9 vs IDT71V35761S183PFG8 |
| IDT71V35761S183PFGI | Cache SRAM, 128KX36, 3.3ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S183PF9 vs IDT71V35761S183PFGI |
| IDT71V35761S183PFI9 | Cache SRAM, 128KX36, 3.3ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S183PF9 vs IDT71V35761S183PFI9 |