| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
71V35761S166PFGI8-ND
|
DigiKey | IC SRAM 4.5MBIT PARALLEL 100TQFP Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
|
$7.5999 | Buy Now | |
|
DISTI #
71V35761S166PFGI8
|
Avnet Americas | 3.3V 128K x 36 Synchronous PipeLined Burst SRAM w/3.3V I/O - Tape and Reel (Alt: 71V35761S166PFGI8) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0 |
|
$6.9342 / $7.9170 | Buy Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel | 0Reel |
|
$6.8300 | Buy Now | ||
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel | 0Reel |
|
$6.8300 | Buy Now |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
End Of Life
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
TQFP
|
|
Pin Count
|
100
|
|
Manufacturer Package Code
|
PKG100
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
NLR
|
|
HTS Code
|
8542320041
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
3.5 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
166 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PQFP-G100
|
|
JESD-609 Code
|
e3
|
|
Length
|
20 mm
|
|
Memory Density
|
4718592 bit
|
|
Memory IC Type
|
CACHE SRAM
|
|
Memory Width
|
36
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
100
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
128KX36
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LQFP
|
|
Package Equivalence Code
|
QFP100,.63X.87
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
FLATPACK, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.6 mm
|
|
Standby Current-Max
|
0.035 A
|
|
Standby Voltage-Min
|
3.14 V
|
|
Supply Current-Max
|
0.33 mA
|
|
Supply Voltage-Max (Vsup)
|
3.465 V
|
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
MATTE TIN
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.65 mm
|
|
Terminal Position
|
QUAD
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
14 mm
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT71V35761S166PFI | Cache SRAM, 128KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S166PFGI8 vs IDT71V35761S166PFI |
| 71V35761S166PFGI | 3.3V 128K x 36 Synchronous PipeLined Burst SRAM w/3.3V I/O, TQFP72/Tray | Renesas Electronics Corporation | 71V35761S166PFGI8 vs 71V35761S166PFGI |
| 71V35761S166PFI | Cache SRAM, 128KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S166PFGI8 vs 71V35761S166PFI |
| IDT71V35761S166PFI8 | Cache SRAM, 128KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S166PFGI8 vs IDT71V35761S166PFI8 |
| 71V35761S166PFI8 | Cache SRAM, 128KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | 71V35761S166PFGI8 vs 71V35761S166PFI8 |
