Part Details for 71P74604S250BQ8 by Integrated Device Technology Inc
Overview of 71P74604S250BQ8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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71P74604S250BQ8 | Renesas Electronics Corporation | 18Mb Pipelined QDR™II SRAM Burst of 4 512K x 36 |
Part Details for 71P74604S250BQ8
71P74604S250BQ8 CAD Models
71P74604S250BQ8 Part Data Attributes
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71P74604S250BQ8
Integrated Device Technology Inc
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Datasheet
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71P74604S250BQ8
Integrated Device Technology Inc
CABGA-165, Reel
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | CABGA | |
Package Description | 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
Pin Count | 165 | |
Manufacturer Package Code | BQ165 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Category CO2 Kg | 12 | |
Compliance Temperature Grade | Commercial: +0C to +70C | |
Candidate List Date | 2018-06-27 | |
SVHC Over MCV | 7439-92-1 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 250 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.375 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 1.1 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for 71P74604S250BQ8
This table gives cross-reference parts and alternative options found for 71P74604S250BQ8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71P74604S250BQ8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
IDT71P74604S200BQ | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | Integrated Device Technology Inc | 71P74604S250BQ8 vs IDT71P74604S200BQ |
71P74604S200BQG8 | CABGA-165, Reel | Integrated Device Technology Inc | 71P74604S250BQ8 vs 71P74604S200BQG8 |
71P74604S200BQG | CABGA-165, Tray | Integrated Device Technology Inc | 71P74604S250BQ8 vs 71P74604S200BQG |
71P74604S200BQ | CABGA-165, Tray | Integrated Device Technology Inc | 71P74604S250BQ8 vs 71P74604S200BQ |
71P74604S250BQG | CABGA-165, Tray | Integrated Device Technology Inc | 71P74604S250BQ8 vs 71P74604S250BQG |