There are no models available for this part yet.
Overview of 71P72804S167BQG by Integrated Device Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 71P72804S167BQG | Renesas Electronics Corporation | QDRII BURST OF 2 X18 | |
| 71P72804S167BQGI | Renesas Electronics Corporation | QDRII BURST OF 2 X18 | |
| 71P72804S167BQGI8 | Renesas Electronics Corporation | QDRII BURST OF 2 X18 |
Price & Stock for 71P72804S167BQG by Integrated Device Technology Inc
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
2156-71P72804S167BQG-ND
|
DigiKey | IC SRAM 18MBIT PAR 165CABGA Min Qty: 56 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
15466 In Stock |
|
$5.4100 | Buy Now | |
| Rochester Electronics | 71P72804 - 18Mbit Pipelined QDRII SRAM Burst Of 2 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 15466 |
|
$4.6400 / $5.4600 | Buy Now |
CAD Models for 71P72804S167BQG by Integrated Device Technology Inc
Part Data Attributes for 71P72804S167BQG by Integrated Device Technology Inc
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTEGRATED DEVICE TECHNOLOGY INC
|
|
Part Package Code
|
CABGA
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|
Package Description
|
13 X 15 MM, GREEN, FPBGA-165
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Pin Count
|
165
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Manufacturer Package Code
|
BQG165
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Reach Compliance Code
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unknown
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ECCN Code
|
3A991.B.2.A
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|
HTS Code
|
8542.32.00.41
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|
Access Time-Max
|
0.5 ns
|
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Additional Feature
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PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
167 MHz
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I/O Type
|
SEPARATE
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|
JESD-30 Code
|
R-PBGA-B165
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JESD-609 Code
|
e1
|
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Length
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15 mm
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|
Memory Density
|
18874368 bit
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Memory IC Type
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QDR SRAM
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Memory Width
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18
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Moisture Sensitivity Level
|
3
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Number of Functions
|
1
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Number of Terminals
|
165
|
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Number of Words
|
1048576 words
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Number of Words Code
|
1000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
1MX18
|
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Output Characteristics
|
3-STATE
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Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
TBGA
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Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
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Package Style
|
GRID ARRAY, THIN PROFILE
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|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
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Qualification Status
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Not Qualified
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Seated Height-Max
|
1.2 mm
|
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Standby Current-Max
|
0.3 A
|
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Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.65 mA
|
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Supply Voltage-Max (Vsup)
|
1.9 V
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Supply Voltage-Min (Vsup)
|
1.7 V
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Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
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Technology
|
CMOS
|
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Temperature Grade
|
COMMERCIAL
|
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Terminal Finish
|
TIN SILVER COPPER
|
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Terminal Form
|
BALL
|
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Terminal Pitch
|
1 mm
|
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Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
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Width
|
13 mm
|