Part Details for 7187S55DB by Integrated Device Technology Inc
Overview of 7187S55DB by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Environmental Monitoring
Industrial Automation
Agriculture Technology
Medical Imaging
Electronic Manufacturing
Part Details for 7187S55DB
7187S55DB CAD Models
7187S55DB Part Data Attributes:
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7187S55DB
Integrated Device Technology Inc
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Datasheet
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7187S55DB
Integrated Device Technology Inc
CDIP-22, Tube
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | CDIP | |
Package Description | DIP, DIP22,.3 | |
Pin Count | 22 | |
Manufacturer Package Code | CD22 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 55 ns | |
I/O Type | SEPARATE | |
JESD-30 Code | R-CDIP-T22 | |
JESD-609 Code | e0 | |
Memory Density | 65536 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 22 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 64KX1 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP22,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 Class B | |
Standby Current-Max | 0.02 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 0.12 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for 7187S55DB
This table gives cross-reference parts and alternative options found for 7187S55DB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 7187S55DB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
UPD4361C-55 | Standard SRAM, 64KX1, 55ns, CMOS, PDIP22, PLASTIC, DIP-22 | NEC Electronics Group | 7187S55DB vs UPD4361C-55 |
FT6187L-70DMB | Standard SRAM, 64KX1, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 | Force Technologies Ltd | 7187S55DB vs FT6187L-70DMB |
UPD4361C-70 | Standard SRAM, 64KX1, 70ns, CMOS, PDIP22, PLASTIC, DIP-22 | NEC Electronics Group | 7187S55DB vs UPD4361C-70 |
5962-8601507YA | CDIP-22, Tube | Integrated Device Technology Inc | 7187S55DB vs 5962-8601507YA |
P4C187L-55CMB | Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-22 | Pyramid Semiconductor Corporation | 7187S55DB vs P4C187L-55CMB |
FT6187L-70CMB | Standard SRAM, 64KX1, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 | Force Technologies Ltd | 7187S55DB vs FT6187L-70CMB |
IDT7187S55CB | Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-22 | Integrated Device Technology Inc | 7187S55DB vs IDT7187S55CB |
5962-8601506XX | Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 | Micross Components | 7187S55DB vs 5962-8601506XX |
AM99C641-70/BWA | Standard SRAM, 64KX1, 70ns, CMOS, CDIP22, 0.300 INCH, SLIM, HERMETIC SEALED, CERAMIC, DIP-22 | AMD | 7187S55DB vs AM99C641-70/BWA |
UPD4361C-70L | Standard SRAM, 64KX1, 70ns, CMOS, PDIP22, PLASTIC, DIP-22 | NEC Electronics Group | 7187S55DB vs UPD4361C-70L |