Part Details for 7164S100TDGB by Integrated Device Technology Inc
Overview of 7164S100TDGB by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Part Details for 7164S100TDGB
7164S100TDGB CAD Models
7164S100TDGB Part Data Attributes
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7164S100TDGB
Integrated Device Technology Inc
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Datasheet
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7164S100TDGB
Integrated Device Technology Inc
Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.300 INCH, GREEN, CERAMIC, DIP-28
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 100 ns | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e3 | |
| Length | 37.1475 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 5.08 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.62 mm |
Alternate Parts for 7164S100TDGB
This table gives cross-reference parts and alternative options found for 7164S100TDGB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 7164S100TDGB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 7164S100TDGB8 | Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.300 INCH, GREEN, CERAMIC, DIP-28 | Integrated Device Technology Inc | 7164S100TDGB vs 7164S100TDGB8 |
| IDT7164L100DB | Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Integrated Device Technology Inc | 7164S100TDGB vs IDT7164L100DB |
| 5962-8552512XA | CDIP-28, Tube | Integrated Device Technology Inc | 7164S100TDGB vs 5962-8552512XA |
| 7164L100DB | CDIP-28, Tube | Integrated Device Technology Inc | 7164S100TDGB vs 7164L100DB |
| 7164S100TPGB | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, GREEN, PLASTIC, DIP-28 | Integrated Device Technology Inc | 7164S100TDGB vs 7164S100TPGB |