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Memory / SRAMs / 70V639S12BFGI
Datasheets
70V639S12BFGI by:
Integrated Device Technology Inc
Integrated Device Technology Inc
Renesas Electronics Corporation
Not Found

CABGA-208, Tray

Part Details for 70V639S12BFGI by Integrated Device Technology Inc

Results Overview of 70V639S12BFGI by Integrated Device Technology Inc

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Applications Education and Research Aerospace and Defense Communication and Networking

70V639S12BFGI Information

70V639S12BFGI by Integrated Device Technology Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
70V639S12BFGI8 Renesas Electronics Corporation 128K x 18 3.3V Dual-Port RAM, Interleaved I/O's
70V639S12BFGI Renesas Electronics Corporation 128K x 18 3.3V Dual-Port RAM, Interleaved I/O's

Part Details for 70V639S12BFGI

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70V639S12BFGI Part Data Attributes

Parametric Data
70V639S12BFGI Integrated Device Technology Inc
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70V639S12BFGI Integrated Device Technology Inc CABGA-208, Tray
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA
Package Description 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208
Pin Count 208
Manufacturer Package Code BFG208
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 12 ns
I/O Type COMMON
JESD-30 Code S-PBGA-B208
JESD-609 Code e1
Length 15 mm
Memory Density 2359296 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 3.15 V
Supply Current-Max 0.515 mA
Supply Voltage-Max (Vsup) 3.45 V
Supply Voltage-Min (Vsup) 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm

Alternate Parts for 70V639S12BFGI

This table gives cross-reference parts and alternative options found for 70V639S12BFGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V639S12BFGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
IDT70V639S12BFI8 Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 70V639S12BFGI vs IDT70V639S12BFI8
IDT70V639S12BFG Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 70V639S12BFGI vs IDT70V639S12BFG
IDT70V639S12BFI Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 70V639S12BFGI vs IDT70V639S12BFI
70V639S12BFI8 Renesas Electronics Corporation Check for Price 128K x 18 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel 70V639S12BFGI vs 70V639S12BFI8
70V639S12BFGI8 Integrated Device Technology Inc Check for Price CABGA-208, Reel 70V639S12BFGI vs 70V639S12BFGI8
70V639S12BFG8 Integrated Device Technology Inc Check for Price Application Specific SRAM, 128KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 70V639S12BFGI vs 70V639S12BFG8
70V639S12BFGI Renesas Electronics Corporation Check for Price 128K x 18 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray 70V639S12BFGI vs 70V639S12BFGI
IDT70V639S12BF Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 70V639S12BFGI vs IDT70V639S12BF
Part Number Manufacturer Composite Price Description Compare
70V639S12BFGI8 Renesas Electronics Corporation Check for Price 128K x 18 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel 70V639S12BFGI vs 70V639S12BFGI8
IDT70V639S12BFGI8 Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA208, FINE PITCH, BGA-208 70V639S12BFGI vs IDT70V639S12BFGI8
IDT70V639S12BFGI Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 70V639S12BFGI vs IDT70V639S12BFGI
IDT70V639S12BCG8 Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA256, BGA-256 70V639S12BFGI vs IDT70V639S12BCG8
70V639S12BCI8 Renesas Electronics Corporation Check for Price 128K x 18 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel 70V639S12BFGI vs 70V639S12BCI8
70V639S12BF8 Renesas Electronics Corporation Check for Price 128K x 18 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel 70V639S12BFGI vs 70V639S12BF8
70V639S12BCG Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 70V639S12BFGI vs 70V639S12BCG
IDT70V639S12PRF8 Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PQFP128, 14 X 20 MM, 1.40 MM HEIGHT, TQFP-128 70V639S12BFGI vs IDT70V639S12PRF8
IDT70V639S12BC Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 70V639S12BFGI vs IDT70V639S12BC
IDT70V639S12BCG Integrated Device Technology Inc Check for Price Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 70V639S12BFGI vs IDT70V639S12BCG

70V639S12BFGI Related Parts

70V639S12BFGI Frequently Asked Questions (FAQ)

  • A good PCB layout for the 70V639S12BFGI involves keeping the clock and data lines as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.

  • To ensure reliable data transfer with the 70V639S12BFGI, make sure to use a reliable clock source, use a suitable transmission line impedance, and implement error detection and correction mechanisms such as CRC and parity bits. Additionally, ensure that the device is properly terminated and that the signal integrity is maintained.

  • The 70V639S12BFGI has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, use a thermal interface material, and ensure good airflow around the device. It's also recommended to monitor the device temperature and implement thermal throttling or shutdown mechanisms to prevent overheating.

  • To troubleshoot issues with the 70V639S12BFGI, start by checking the power supply voltage, clock frequency, and signal integrity. Use oscilloscopes and logic analyzers to debug the device's behavior. Check the device's configuration and programming, and ensure that the device is properly reset and initialized. Consult the datasheet and application notes for troubleshooting guidelines and FAQs.

  • To minimize EMI and RFI with the 70V639S12BFGI, use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters and chokes on the power and signal lines. Ensure that the PCB layout is designed to minimize radiation and that the device is properly grounded and shielded.