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Memory / SRAMs / 70V3319S133BCGI
Datasheets
70V3319S133BCGI by:

256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray

Part Details for 70V3319S133BCGI by Renesas Electronics Corporation

Overview of 70V3319S133BCGI by Renesas Electronics Corporation

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Education and Research Industrial Automation Electronic Manufacturing

Available Datasheets

Part # Manufacturer Description Datasheet
70V3319S133BCGI Renesas Electronics Corporation 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's

Price & Stock for 70V3319S133BCGI

Part # Distributor Description Stock Price Buy
DISTI # 70V3319S133BCGI-ND
DigiKey IC SRAM 4.5MBIT PAR 256CABGA Min Qty: 24 Lead time: 18 Weeks Container: Tray Temporarily Out of Stock
  • 24 $213.7929
$213.7929 Buy Now
DISTI # 70V3319S133BCGI
Avnet Americas 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's - Trays (Alt: 70V3319S133BCGI) RoHS: Compliant Min Qty: 24 Package Multiple: 6 Lead time: 18 Weeks, 0 Days Container: Tray 0
  • 1 $170.4333
$170.4333 Buy Now
DISTI # 972-70V3319S133BCGI
Mouser Electronics SRAM 256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM RoHS: Compliant 12
  • 1 $214.4200
  • 12 $211.1400
  • 30 $206.5100
$206.5100 / $214.4200 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 24 Package Multiple: 6 Lead time: 18 Weeks Container: Tray 0
Tray
  • 24 $199.2100
$199.2100 Buy Now
DISTI # 70V3319S133BCGI
Avnet Silica 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's (Alt: 70V3319S133BCGI) RoHS: Compliant Min Qty: 6 Package Multiple: 6 Lead time: 19 Weeks, 0 Days Silica - 0
Buy Now

Part Details for 70V3319S133BCGI

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70V3319S133BCGI Part Data Attributes

Parametric Data
70V3319S133BCGI Renesas Electronics Corporation
Buy Now Datasheet
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70V3319S133BCGI Renesas Electronics Corporation 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code CABGA
Pin Count 256
Manufacturer Package Code BCG256
Reach Compliance Code compliant
ECCN Code NLR
HTS Code 8542320041
Factory Lead Time 18 Weeks
Samacsys Manufacturer Renesas Electronics
Access Time-Max 4.2 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code S-CBGA-B256
JESD-609 Code e1
Length 17 mm
Memory Density 4718592 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 256
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.04 A
Standby Voltage-Min 3.15 V
Supply Current-Max 0.48 mA
Supply Voltage-Max (Vsup) 3.45 V
Supply Voltage-Min (Vsup) 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

Alternate Parts for 70V3319S133BCGI

This table gives cross-reference parts and alternative options found for 70V3319S133BCGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V3319S133BCGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IDT70V3319S133BCGI Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70V3319S133BCGI vs IDT70V3319S133BCGI
70T3319S133BCI8 CABGA-256, Reel Integrated Device Technology Inc 70V3319S133BCGI vs 70T3319S133BCI8
70V3319S133BCG8 Application Specific SRAM, 256KX18, 4.2ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70V3319S133BCGI vs 70V3319S133BCG8
IDT70T3319S133BCI8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70V3319S133BCGI vs IDT70T3319S133BCI8
70V3319S133BC 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation 70V3319S133BCGI vs 70V3319S133BC
70T3319S133BCGI8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70V3319S133BCGI vs 70T3319S133BCGI8
70V3319S133BCI8 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70V3319S133BCGI vs 70V3319S133BCI8
70V3319S133BCI 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation 70V3319S133BCGI vs 70V3319S133BCI
70V3319S133BC8 CABGA-256, Reel Integrated Device Technology Inc 70V3319S133BCGI vs 70V3319S133BC8
70T3319S133BCI CABGA-256, Tray Integrated Device Technology Inc 70V3319S133BCGI vs 70T3319S133BCI
Part Number Description Manufacturer Compare
70T3319S133BCI CABGA-256, Tray Integrated Device Technology Inc 70V3319S133BCGI vs 70T3319S133BCI
IDT70V3319S133BC8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70V3319S133BCGI vs IDT70V3319S133BC8
IDT70T3319S133DDI Dual-Port SRAM, 256KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Integrated Device Technology Inc 70V3319S133BCGI vs IDT70T3319S133DDI
70V3319S133BFG Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70V3319S133BCGI vs 70V3319S133BFG
IDT70T3319S133DD Dual-Port SRAM, 256KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Integrated Device Technology Inc 70V3319S133BCGI vs IDT70T3319S133DD
IDT70T3319S133DDG Dual-Port SRAM, 256KX18, 4.2ns, CMOS, PQFP144, 20 X 20 MM X 1.4 MM, GREEN, TQFP-144 Integrated Device Technology Inc 70V3319S133BCGI vs IDT70T3319S133DDG
70V3319S133BF CABGA-208, Tray Integrated Device Technology Inc 70V3319S133BCGI vs 70V3319S133BF
70T3319S133BFI CABGA-208, Tray Integrated Device Technology Inc 70V3319S133BCGI vs 70T3319S133BFI
70T3319S133BF8 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70V3319S133BCGI vs 70T3319S133BF8
IDT70V3319S133BCG8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, BGA-256 Integrated Device Technology Inc 70V3319S133BCGI vs IDT70V3319S133BCG8

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