| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 70V35L20PFGI8 | Renesas Electronics Corporation | 8K x 18 3.3V Dual-Port RAM |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
TQFP
|
|
Pin Count
|
100
|
|
Manufacturer Package Code
|
PNG100
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
NLR
|
|
HTS Code
|
8542320041
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
20 ns
|
|
JESD-30 Code
|
S-PQFP-G100
|
|
JESD-609 Code
|
e3
|
|
Length
|
14 mm
|
|
Memory Density
|
147456 bit
|
|
Memory IC Type
|
MULTI-PORT SRAM
|
|
Memory Width
|
18
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
100
|
|
Number of Words
|
8192 words
|
|
Number of Words Code
|
8000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
8KX18
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFQFP
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
FLATPACK, LOW PROFILE, FINE PITCH
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Seated Height-Max
|
1.6 mm
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
3 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
MATTE TIN
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
QUAD
|
|
Width
|
14 mm
|
