Part Details for 70V3319S166BC8 by Integrated Device Technology Inc
Overview of 70V3319S166BC8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 70V3319S166BC8 | Renesas Electronics Corporation | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's |
Part Details for 70V3319S166BC8
70V3319S166BC8 CAD Models
70V3319S166BC8 Part Data Attributes
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70V3319S166BC8
Integrated Device Technology Inc
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Datasheet
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70V3319S166BC8
Integrated Device Technology Inc
CABGA-256, Reel
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CABGA | |
| Package Description | 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | |
| Pin Count | 256 | |
| Manufacturer Package Code | BC256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 12 ns | |
| Additional Feature | PIPELINED OR FLOW-THROUGH ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Standby Current-Max | 0.03 A | |
| Standby Voltage-Min | 3.15 V | |
| Supply Current-Max | 0.5 mA | |
| Supply Voltage-Max (Vsup) | 3.45 V | |
| Supply Voltage-Min (Vsup) | 3.15 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |
Alternate Parts for 70V3319S166BC8
This table gives cross-reference parts and alternative options found for 70V3319S166BC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V3319S166BC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 70T3319S166BCGI8 | Integrated Device Technology Inc | Check for Price | Application Specific SRAM, 128KX18, 3.6ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | 70V3319S166BC8 vs 70T3319S166BCGI8 |
| 70V3319S166BCG | Integrated Device Technology Inc | Check for Price | CABGA-256, Tray | 70V3319S166BC8 vs 70V3319S166BCG |
| 70V3319S166BC8 | Renesas Electronics Corporation | Check for Price | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA0/Reel | 70V3319S166BC8 vs 70V3319S166BC8 |
| IDT70T3319S166BCG8 | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | 70V3319S166BC8 vs IDT70T3319S166BCG8 |
| 70V3319S166BCG8 | Integrated Device Technology Inc | Check for Price | Application Specific SRAM, 256KX18, 4ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | 70V3319S166BC8 vs 70V3319S166BCG8 |
| 70T3319S166BC8 | Integrated Device Technology Inc | Check for Price | CABGA-256, Reel | 70V3319S166BC8 vs 70T3319S166BC8 |
| IDT70V3319S166BCG | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | 70V3319S166BC8 vs IDT70V3319S166BCG |
| 70T3319S166BC | Renesas Electronics Corporation | Check for Price | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | 70V3319S166BC8 vs 70T3319S166BC |
| IDT70V3319S166BC | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | 70V3319S166BC8 vs IDT70V3319S166BC |