Memory
70T3519S133BFG
Description: Dual-Port SRAM, 256KX36, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208

Overview of 70T3519S133BFG by Integrated Device Technology Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
70T3519S133BFGI Renesas Electronics Corporation 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's
70T3519S133BFGI8 Renesas Electronics Corporation 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's

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Part Data Attributes for 70T3519S133BFG by Integrated Device Technology Inc

70T3519S133BFG
Integrated Device Technology Inc
-
-
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
Package Description
BGA, BGA208,17X17,32
Pin Count
208
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
15 ns
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
S-PBGA-B208
JESD-609 Code
e1
Length
15 mm
Memory Density
9437184 bit
Memory IC Type
MULTI-PORT SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
2
Number of Terminals
208
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA208,17X17,32
Package Shape
SQUARE
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.7 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.37 mA
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
15 mm
Want to compare parts?
  1. 70T3519S133BFG
    Integrated Device Technology Inc
    Dual-Port SRAM, 256KX36, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208
    VS

Alternate Parts for 70T3519S133BFG

This table gives cross-reference parts and alternative options found for 70T3519S133BFG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3519S133BFG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
IDT70T3519S133BF Dual-Port SRAM, 256KX36, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3519S133BFG vs IDT70T3519S133BF
70T3519S133BFI8 CABGA-208, Reel Integrated Device Technology Inc 70T3519S133BFG vs 70T3519S133BFI8
70T3519S133BF8 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3519S133BFG vs 70T3519S133BF8
70T3519S133BF8 CABGA-208, Reel Integrated Device Technology Inc 70T3519S133BFG vs 70T3519S133BF8
IDT70T3519S133BF8 Dual-Port SRAM, 256KX36, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3519S133BFG vs IDT70T3519S133BF8
70T3519S133BFI8 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3519S133BFG vs 70T3519S133BFI8
70T3519S133BF 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray Renesas Electronics Corporation 70T3519S133BFG vs 70T3519S133BF
70T3519S133BFGI CABGA-208, Tray Integrated Device Technology Inc 70T3519S133BFG vs 70T3519S133BFGI
70T3519S133BFGI8 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3519S133BFG vs 70T3519S133BFGI8
70T3519S133BF CABGA-208, Tray Integrated Device Technology Inc 70T3519S133BFG vs 70T3519S133BF
Part Number Description Manufacturer Compare
IDT70T651S10DRG Dual-Port SRAM, 256KX36, 10ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM PITCH, GREEN, PLASTIC, QFP-208 Integrated Device Technology Inc 70T3519S133BFG vs IDT70T651S10DRG
IDT70T651S10BFG8 Dual-Port SRAM, 256KX36, 10ns, CMOS, PBGA208, FBGA-208 Integrated Device Technology Inc 70T3519S133BFG vs IDT70T651S10BFG8
70V7519S166DRI PQFP-208, Tray Integrated Device Technology Inc 70T3519S133BFG vs 70V7519S166DRI
IDT70T3519S166DRGI Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PQFP208, 28 MM X 28 MM X 3.5 MM, GREEN, PLASTIC, QFP-208 Integrated Device Technology Inc 70T3519S133BFG vs IDT70T3519S166DRGI
70T3519S166DRGI Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PQFP208, 28 MM X 28 MM X 3.5 MM, GREEN, PLASTIC, QFP-208 Integrated Device Technology Inc 70T3519S133BFG vs 70T3519S166DRGI
IDT70V7519S200DR Dual-Port SRAM, 256KX36, 10ns, CMOS, PQFP208, PLASTIC, QFP-208 Integrated Device Technology Inc 70T3519S133BFG vs IDT70V7519S200DR
70T651S12DRI PQFP-208, Tray Integrated Device Technology Inc 70T3519S133BFG vs 70T651S12DRI
IDT70T651S10DR Dual-Port SRAM, 256KX36, 10ns, CMOS, PQFP208, PLASTIC, QFP-208 Integrated Device Technology Inc 70T3519S133BFG vs IDT70T651S10DR
70T651S10BF8 CABGA-208, Reel Integrated Device Technology Inc 70T3519S133BFG vs 70T651S10BF8
AS9C25256M2036L-166PC Dual-Port SRAM, 256KX36, 10ns, CMOS, PQFP208, PLASTIC, TQFP-208 Integrated Silicon Solution Inc 70T3519S133BFG vs AS9C25256M2036L-166PC

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