Part Details for 70T3319S166BCI by Integrated Device Technology Inc
Overview of 70T3319S166BCI by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Energy and Power Systems
Renewable Energy
Automotive
Part Details for 70T3319S166BCI
70T3319S166BCI CAD Models
70T3319S166BCI Part Data Attributes
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70T3319S166BCI
Integrated Device Technology Inc
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Datasheet
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70T3319S166BCI
Integrated Device Technology Inc
Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 12 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Standby Current-Max | 0.02 A | |
| Standby Voltage-Min | 2.4 V | |
| Supply Current-Max | 0.51 mA | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |
Alternate Parts for 70T3319S166BCI
This table gives cross-reference parts and alternative options found for 70T3319S166BCI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3319S166BCI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70V3319S166BCG | Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3319S166BCI vs IDT70V3319S166BCG |
| IDT70V3319S166BC | Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3319S166BCI vs IDT70V3319S166BC |
| IDT70T3319S166BCGI | Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3319S166BCI vs IDT70T3319S166BCGI |
| 70T3319S166BC8 | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70T3319S166BCI vs 70T3319S166BC8 |
| 70V3319S166BCG | CABGA-256, Tray | Integrated Device Technology Inc | 70T3319S166BCI vs 70V3319S166BCG |
| 70V3319S166BC8 | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70T3319S166BCI vs 70V3319S166BC8 |
| 70T3319S166BCG | Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3319S166BCI vs 70T3319S166BCG |
| 70T3319S166BC8 | CABGA-256, Reel | Integrated Device Technology Inc | 70T3319S166BCI vs 70T3319S166BC8 |
| 70T3319S166BCG8 | Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3319S166BCI vs 70T3319S166BCG8 |
| 70T3319S166BC | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70T3319S166BCI vs 70T3319S166BC |