Part Details for 68602-166HLF by Amphenol Corporation
Overview of 68602-166HLF by Amphenol Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Not Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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68602-166HLF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in)Pitch. | |
68602-110HLF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in)Pitch. | |
68602-210HLF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in)Pitch. |
Price & Stock for 68602-166HLF
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
68602-166HLF
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Avnet Americas | Conn Unshrouded Header HDR 66 POS 2.54mm Solder ST Thru-Hole Poly Bag - Bulk (Alt: 68602-166HLF) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Container: Bulk | 0 |
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RFQ |