Part Details for 66AK2H12BAAW24 by Texas Instruments
Overview of 66AK2H12BAAW24 by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 66AK2H12BAAW24
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-66AK2H12BAAW24-TI-ND
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DigiKey | IC DSP ARM SOC 1517FCBGA Min Qty: 1 Lead time: 48 Weeks Container: Tray MARKETPLACE PRODUCT |
8 In Stock |
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$554.2300 | Buy Now |
DISTI #
66AK2H12BAAW24-ND
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DigiKey | IC DSP ARM SOC 1517FCBGA Min Qty: 1 Lead time: 48 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now | |
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Rochester Electronics | RISC Microprocessor, OMAP and ARM Cortex-A15, 1400MHz, CMOS, PBGA1517 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 8 |
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RFQ |
Part Details for 66AK2H12BAAW24
66AK2H12BAAW24 CAD Models
66AK2H12BAAW24 Part Data Attributes
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66AK2H12BAAW24
Texas Instruments
Buy Now
Datasheet
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66AK2H12BAAW24
Texas Instruments
Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1517-FCBGA 0 to 85
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | FCBGA-1517 | |
Reach Compliance Code | compliant | |
Address Bus Width | 16 | |
Boundary Scan | YES | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B1517 | |
JESD-609 Code | e1 | |
Length | 40 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1517 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 3.75 mm | |
Speed | 1400 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 40 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |