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Part Details for 66AK2G12ABYA60E by Texas Instruments
Overview of 66AK2G12ABYA60E by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Available)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Security and Surveillance
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 66AK2G12ABYA60E | Texas Instruments | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA -40 to 105 |
Price & Stock for 66AK2G12ABYA60E
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
66AK2G12ABYA60E-ND
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DigiKey | DSP/DSC Min Qty: 60 Lead time: 18 Weeks Container: Bulk | Temporarily Out of Stock |
|
$53.9268 | Buy Now |
|
DISTI #
595-66AK2G12ABYA60E
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core 625-FCCSP -40 to 105 RoHS: Compliant | 4 |
|
$54.9100 / $62.5900 | Buy Now |
Part Details for 66AK2G12ABYA60E
66AK2G12ABYA60E CAD Models
66AK2G12ABYA60E Part Data Attributes
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66AK2G12ABYA60E
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
66AK2G12ABYA60E
Texas Instruments
High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core 625-FCCSP -40 to 105
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | LFBGA, BGA625,25X25,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| JESD-30 Code | S-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 625 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA625,25X25,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.56 mm | |
| Supply Voltage-Max | 0.945 V | |
| Supply Voltage-Min | 0.855 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |
Alternate Parts for 66AK2G12ABYA60E
This table gives cross-reference parts and alternative options found for 66AK2G12ABYA60E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 66AK2G12ABYA60E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 66AK2G12ABYA60 | High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core 625-FCCSP -40 to 105 | Texas Instruments | 66AK2G12ABYA60E vs 66AK2G12ABYA60 |