Part Details for 63446-1130 by Molex
Overview of 63446-1130 by Molex
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Not Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
BLA1011-300 | Rochester Electronics LLC | BLA1011-300 - 300W LDMOS Avionics Power Transistor (Ampleon Die) | |
SAF-TC1130-L150EB-GBB-G | Rochester Electronics LLC | TC1130 - 32-Bit RISC FLASH Microcontroller | |
92634-460HLF | Amphenol Communications Solutions | BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 60 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail. |
Price & Stock for 63446-1130
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
56R3089
|
Newark | Insulation Punch |Molex 63446-1130 RoHS: Not Compliant Min Qty: 3 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$279.4300 / $327.4500 | Buy Now |
DISTI #
538-63446-1130
|
Mouser Electronics | Punches & Dies INSULATION PUNCH | 0 |
|
$316.5100 / $338.3400 | Order Now |
|
Onlinecomponents.com | RoHS: Compliant | 0 |
|
$416.5100 / $623.8500 | Buy Now |