Part Details for 5962H3829437BXX by Cobham Semiconductor Solutions
Overview of 5962H3829437BXX by Cobham Semiconductor Solutions
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 5962H3829437BXX
5962H3829437BXX CAD Models
5962H3829437BXX Part Data Attributes
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5962H3829437BXX
Cobham Semiconductor Solutions
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Datasheet
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5962H3829437BXX
Cobham Semiconductor Solutions
Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, 0.600 X 1.200 INCH, 0.100 INCH PITCH, CERAMIC, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | AEROFLEX COLORADO SPRINGS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.1.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Length | 35.56 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38535 Class Q | |
| Seated Height-Max | 4.445 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Total Dose | 1M Rad(Si) V | |
| Width | 15.24 mm |
Alternate Parts for 5962H3829437BXX
This table gives cross-reference parts and alternative options found for 5962H3829437BXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962H3829437BXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962R3829437SXX | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, 0.600 X 1.200 INCH, 0.100 INCH PITCH, CERAMIC, DIP-28 | Cobham Semiconductor Solutions | 5962H3829437BXX vs 5962R3829437SXX |
| HM1E-65764N-9 | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28 | Matra MHS | 5962H3829437BXX vs HM1E-65764N-9 |
| HM3E-65764N-5 | Standard SRAM, 8KX8, 55ns, CMOS, PDIP28 | Matra MHS | 5962H3829437BXX vs HM3E-65764N-5 |
| 5962H3829437SXA | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cobham Semiconductor Solutions | 5962H3829437BXX vs 5962H3829437SXA |
| 5962H3829437BXA | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cobham Semiconductor Solutions | 5962H3829437BXX vs 5962H3829437BXA |
| HM3E-65764N-6 | Standard SRAM, 8KX8, 55ns, CMOS, PDIP28 | Matra MHS | 5962H3829437BXX vs HM3E-65764N-6 |
| 5962H3829437SXC | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cobham Semiconductor Solutions | 5962H3829437BXX vs 5962H3829437SXC |
| HM3E-65764N-9 | Standard SRAM, 8KX8, 55ns, CMOS, PDIP28, | Temic Semiconductors | 5962H3829437BXX vs HM3E-65764N-9 |
| HM1E-65764N-6 | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28 | Matra MHS | 5962H3829437BXX vs HM1E-65764N-6 |
| HM1E-65764N-2 | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | Temic Semiconductors | 5962H3829437BXX vs HM1E-65764N-2 |