Part Details for 5962-9679603HYA by Microsemi Corporation
Overview of 5962-9679603HYA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 5962-9679603HYA
5962-9679603HYA CAD Models
5962-9679603HYA Part Data Attributes
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5962-9679603HYA
Microsemi Corporation
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5962-9679603HYA
Microsemi Corporation
EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.4 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.5 mm | |
| Terminal Position | DUAL | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for 5962-9679603HYA
This table gives cross-reference parts and alternative options found for 5962-9679603HYA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9679603HYA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WME128K8-200CIEA | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WME128K8-200CIEA |
| WE128K8200CM | EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WE128K8200CM |
| WME128K8-200CMA | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WME128K8-200CMA |
| WME128K8-200CQ | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WME128K8-200CQ |
| WME128K8-200CCE | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WME128K8-200CCE |
| WE128K8200CCA | EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WE128K8200CCA |
| WME128K8-200CQEA | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WME128K8-200CQEA |
| WME128K8-200CM | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WME128K8-200CM |
| WE128K8200CIA | EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9679603HYA vs WE128K8200CIA |
| WPE128K8C-200WI | EEPROM, 128KX8, 200ns, Parallel, CMOS, PDIP32, | White Microelectronics | 5962-9679603HYA vs WPE128K8C-200WI |