Part Details for 5962-9559507HMC by White Microelectronics
Overview of 5962-9559507HMC by White Microelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 5962-9559507HMC
5962-9559507HMC CAD Models
5962-9559507HMC Part Data Attributes
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5962-9559507HMC
White Microelectronics
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5962-9559507HMC
White Microelectronics
SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WHITE MICROELECTRONICS | |
| Package Description | CERAMIC, QFP-68 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 35 ns | |
| Additional Feature | USER CONFIGURABLE AS 512K X 8 | |
| Alternate Memory Width | 16 | |
| JESD-30 Code | S-CQFP-G68 | |
| JESD-609 Code | e4 | |
| Memory Density | 4194304 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 68 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | GOLD | |
| Terminal Form | GULL WING | |
| Terminal Position | QUAD |
Alternate Parts for 5962-9559507HMC
This table gives cross-reference parts and alternative options found for 5962-9559507HMC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9559507HMC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS8S128K32QT-35/XT | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, 0.140 INCH HEIGHT, CERAMIC, QFP-68 | Micross Components | 5962-9559507HMC vs AS8S128K32QT-35/XT |
| WS128K32-35G2QA | SRAM Module, 512KX8, 35ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9559507HMC vs WS128K32-35G2QA |
| 5962-9559507HNX | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 | Micross Components | 5962-9559507HMC vs 5962-9559507HNX |
| WS128K32-35G2TIE | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, 22.40 MM, CERAMIC, QFP-68 | White Microelectronics | 5962-9559507HMC vs WS128K32-35G2TIE |
| 5962-9559514HMX | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 | Mercury Systems Inc | 5962-9559507HMC vs 5962-9559514HMX |
| 5962-9559507HAA | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9559507HMC vs 5962-9559507HAA |
| WS128K32-35G2C | SRAM Module, 512KX8, 35ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9559507HMC vs WS128K32-35G2C |
| 5962-9559507HZC | Cache SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 | Cobham Power Products | 5962-9559507HMC vs 5962-9559507HZC |
| AS8S128K32Q-35/IT | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 | Micross Components | 5962-9559507HMC vs AS8S128K32Q-35/IT |
| ACT-S128K32N-035F2Q | Cache SRAM Module, 128KX32, 35ns, CMOS, CQMA68, 0.880 X 0.880 INCH, DUAL CAVITY, CERAMIC, QFP-68 | Cobham PLC | 5962-9559507HMC vs ACT-S128K32N-035F2Q |