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5962-9559507HAC by:

SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68

Part Details for 5962-9559507HAC by Micross Components

Overview of 5962-9559507HAC by Micross Components

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Part Details for 5962-9559507HAC

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5962-9559507HAC Part Data Attributes

5962-9559507HAC Micross Components
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5962-9559507HAC Micross Components SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68
Part Life Cycle Code Active
Ihs Manufacturer MICROSS COMPONENTS
Part Package Code QFP
Package Description QFP, QFP68,.99SQ,50
Pin Count 68
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 35 ns
Additional Feature ALSO CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
I/O Type COMMON
JESD-30 Code S-CQFP-G68
JESD-609 Code e4
Length 22.352 mm
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 68
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Equivalence Code QFP68,.99SQ,50
Package Shape SQUARE
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Standby Voltage-Min 2 V
Supply Current-Max 0.6 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish GOLD
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 22.352 mm

Alternate Parts for 5962-9559507HAC

This table gives cross-reference parts and alternative options found for 5962-9559507HAC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9559507HAC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AS8S128K32QT-35/XT SRAM Module, 128KX32, 35ns, CMOS, CQFP68, 0.140 INCH HEIGHT, CERAMIC, QFP-68 Micross Components 5962-9559507HAC vs AS8S128K32QT-35/XT
WS128K32-35G2QA SRAM Module, 512KX8, 35ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp 5962-9559507HAC vs WS128K32-35G2QA
5962-9559507HNX SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components 5962-9559507HAC vs 5962-9559507HNX
WS128K32-35G2TIE SRAM Module, 128KX32, 35ns, CMOS, CQFP68, 22.40 MM, CERAMIC, QFP-68 White Microelectronics 5962-9559507HAC vs WS128K32-35G2TIE
5962-9559514HMX SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Mercury Systems Inc 5962-9559507HAC vs 5962-9559514HMX
5962-9559507HAA SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 White Electronic Designs Corp 5962-9559507HAC vs 5962-9559507HAA
WS128K32-35G2C SRAM Module, 512KX8, 35ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp 5962-9559507HAC vs WS128K32-35G2C
5962-9559507HZC Cache SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Cobham Power Products 5962-9559507HAC vs 5962-9559507HZC
AS8S128K32Q-35/IT SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components 5962-9559507HAC vs AS8S128K32Q-35/IT
ACT-S128K32N-035F2Q Cache SRAM Module, 128KX32, 35ns, CMOS, CQMA68, 0.880 X 0.880 INCH, DUAL CAVITY, CERAMIC, QFP-68 Cobham PLC 5962-9559507HAC vs ACT-S128K32N-035F2Q
Part Number Description Manufacturer Compare
5962-8866208TX Standard SRAM, 32KX8, 15ns, CMOS, CDFP28, CERAMIC, FP-28 Micross Components 5962-9559507HAC vs 5962-8866208TX
5962-9318708H4X SRAM Module, 128KX32, 25ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66 White Microelectronics 5962-9559507HAC vs 5962-9318708H4X
5962-8685917UX Standard SRAM, 16KX4, 35ns, CMOS, 0.560 X 0.358 INCH, 0.075 HEIGHT, LCC-28 Cypress Semiconductor 5962-9559507HAC vs 5962-8685917UX
5962-9461108HMC Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.200 INCH HEIGHT, DUAL CAVITY, CERAMIC, QFP-68 Cobham Power Products 5962-9559507HAC vs 5962-9461108HMC
5962-8552508XA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, CERDIP-28 Pyramid Semiconductor Corporation 5962-9559507HAC vs 5962-8552508XA
5962-9318701H4A SRAM Module, 128KX32, 120ns, CMOS, HIP-66 Microsemi Corporation 5962-9559507HAC vs 5962-9318701H4A
5962-3829454MZX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components 5962-9559507HAC vs 5962-3829454MZX
FT6264L-12FMB Standard SRAM, 8KX8, 12ns, CMOS, CDFP28, CERAMIC, FLAT PACKAGE, 28 PIN Force Technologies Ltd 5962-9559507HAC vs FT6264L-12FMB
P4C164-35CI Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation 5962-9559507HAC vs P4C164-35CI
DPS128X32V3-85B SRAM Module, 512KX8, 85ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc 5962-9559507HAC vs DPS128X32V3-85B

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