Part Details for 5962-9461108HBC by White Electronic Designs Corp
Overview of 5962-9461108HBC by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Telecommunications
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-9461108HBC
5962-9461108HBC CAD Models
5962-9461108HBC Part Data Attributes
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5962-9461108HBC
White Electronic Designs Corp
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5962-9461108HBC
White Electronic Designs Corp
SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | CERAMIC, QFP-68 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | S-CQFP-G68 | |
| JESD-609 Code | e4 | |
| Length | 23.88 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 68 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFP | |
| Package Equivalence Code | QFP68,.99SQ,50 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38534 Class H | |
| Seated Height-Max | 4.06 mm | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.675 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 23.88 mm |
Alternate Parts for 5962-9461108HBC
This table gives cross-reference parts and alternative options found for 5962-9461108HBC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9461108HBC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS512K32-25G1TI | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9461108HBC vs WS512K32-25G1TI |
| WS512K32-25G1TQ | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9461108HBC vs WS512K32-25G1TQ |
| WS512K32-25G1TMA | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9461108HBC vs WS512K32-25G1TMA |
| WS512K32-25G1TIA | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9461108HBC vs WS512K32-25G1TIA |
| 5962-9461108HBX | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9461108HBC vs 5962-9461108HBX |
| WS512K32-25G1TM | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | 5962-9461108HBC vs WS512K32-25G1TM |