Part Details for 5962-9318706H4A by Micross Components
Overview of 5962-9318706H4A by Micross Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 5962-9318706H4A
5962-9318706H4A CAD Models
5962-9318706H4A Part Data Attributes
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5962-9318706H4A
Micross Components
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Datasheet
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5962-9318706H4A
Micross Components
SRAM Module, 128KX32, 45ns, CMOS, CPGA66, PGA-66
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSS COMPONENTS | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA66,11X11 | |
| Pin Count | 66 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 45 ns | |
| Additional Feature | ALSO CONFIGURABLE AS 512K X 8 | |
| Alternate Memory Width | 16 | |
| I/O Type | COMMON | |
| JESD-30 Code | S-XPGA-P66 | |
| JESD-609 Code | e0 | |
| Length | 27.305 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA66,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 4.953 mm | |
| Standby Current-Max | 0.0116 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.6 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN/LEAD (SN/PB) | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.305 mm |
Alternate Parts for 5962-9318706H4A
This table gives cross-reference parts and alternative options found for 5962-9318706H4A. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9318706H4A, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-9318706H4A | SRAM Module, 128KX32, 45ns, CMOS, CHIP66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 | White Microelectronics | 5962-9318706H4A vs 5962-9318706H4A |
| FTS128K32N-45H1C | Standard SRAM, 128KX32, 45ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 | Force Technologies Ltd | 5962-9318706H4A vs FTS128K32N-45H1C |
| WS128K32N-45HM | SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | 5962-9318706H4A vs WS128K32N-45HM |
| WS128K32N-45HSQE | SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | 5962-9318706H4A vs WS128K32N-45HSQE |
| FTS128K32N-45H1MA | Standard SRAM, 128KX32, 45ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SHIELD, CERAMIC, PGA-66 | Force Technologies Ltd | 5962-9318706H4A vs FTS128K32N-45H1MA |
| WS128K32N-45HSIE | SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | 5962-9318706H4A vs WS128K32N-45HSIE |
| WS128K32N-45HI | SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | 5962-9318706H4A vs WS128K32N-45HI |
| WS128K32N-45HSCE | SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | 5962-9318706H4A vs WS128K32N-45HSCE |
| WS128K32N-45HC | SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | 5962-9318706H4A vs WS128K32N-45HC |
| WS128K32N-45HME | SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | 5962-9318706H4A vs WS128K32N-45HME |