Part Details for 5962-9315401HXC by Microsemi Corporation
Overview of 5962-9315401HXC by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Aerospace and Defense
Transportation and Logistics
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-9315401HXC
5962-9315401HXC CAD Models
5962-9315401HXC Part Data Attributes
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5962-9315401HXC
Microsemi Corporation
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5962-9315401HXC
Microsemi Corporation
EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, SINGLE CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 200 ns | |
| Additional Feature | AUTOMATIC WRITE | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e4 | |
| Length | 42.4 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | GOLD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-9315401HXC
This table gives cross-reference parts and alternative options found for 5962-9315401HXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9315401HXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 28C010TRT2DI-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Maxwell Technologies | 5962-9315401HXC vs 28C010TRT2DI-20 |
| 28C010TRT4DE-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Maxwell Technologies | 5962-9315401HXC vs 28C010TRT4DE-20 |
| 28C010TRT1DS-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Maxwell Technologies | 5962-9315401HXC vs 28C010TRT1DS-20 |
| 5962-9315401HXA | EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, SINGLE CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9315401HXC vs 5962-9315401HXA |
| 28C010TRT4DB-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Maxwell Technologies | 5962-9315401HXC vs 28C010TRT4DB-20 |
| 28C010TRT2DS-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Maxwell Technologies | 5962-9315401HXC vs 28C010TRT2DS-20 |
| 28C010TRT2DB-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Maxwell Technologies | 5962-9315401HXC vs 28C010TRT2DB-20 |
| 28C010TRT1DE-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Maxwell Technologies | 5962-9315401HXC vs 28C010TRT1DE-20 |