Part Details for 5962-9309101HXA by Microsemi Corporation
Overview of 5962-9309101HXA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for 5962-9309101HXA
5962-9309101HXA CAD Models
5962-9309101HXA Part Data Attributes
|
|
5962-9309101HXA
Microsemi Corporation
Buy Now
|
Compare Parts:
5962-9309101HXA
Microsemi Corporation
EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
|
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 150 ns | |
| Additional Feature | AUTOMATIC WRITE | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.4 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.98 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-9309101HXA
This table gives cross-reference parts and alternative options found for 5962-9309101HXA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9309101HXA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT28C040-15BC | EEPROM, 512KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | 5962-9309101HXA vs AT28C040-15BC |
| AT28C040-15BM/883 | EEPROM, 512KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | 5962-9309101HXA vs AT28C040-15BM/883 |
| AT28C040-15BC | EEPROM, 512KX8, 150ns, Parallel, CMOS, CDIP32 | Microchip Technology Inc | 5962-9309101HXA vs AT28C040-15BC |
| 5962-9309101HXC | EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9309101HXA vs 5962-9309101HXC |
| AT28C040-15BM/883 | EEPROM, 512KX8, 150ns, Parallel, CMOS, CDIP32 | Microchip Technology Inc | 5962-9309101HXA vs AT28C040-15BM/883 |