Part Details for 5962-8961406MXC by AMD
Overview of 5962-8961406MXC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 5962-8961406MXC
5962-8961406MXC CAD Models
5962-8961406MXC Part Data Attributes
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5962-8961406MXC
AMD
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5962-8961406MXC
AMD
UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 120 ns | |
| JESD-30 Code | R-GDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.1005 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-8961406MXC
This table gives cross-reference parts and alternative options found for 5962-8961406MXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8961406MXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| FM27C010QE120 | UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | Rochester Electronics LLC | 5962-8961406MXC vs FM27C010QE120 |
| TMS27C010A-12JL | 1 048 576-Bit Programmable Read-Only Memory 32-CDIP 0 to 70 | Texas Instruments | 5962-8961406MXC vs TMS27C010A-12JL |
| MX27C1000DC-12 | UVPROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Macronix International Co Ltd | 5962-8961406MXC vs MX27C1000DC-12 |
| TMS27C010A-12JE | 1 048 576-Bit Programmable Read-Only Memory 32-CDIP -40 to 85 | Texas Instruments | 5962-8961406MXC vs TMS27C010A-12JE |
| AM27C010-125DI | UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | 5962-8961406MXC vs AM27C010-125DI |
| NM27C010Q120 | UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | Fairchild Semiconductor Corporation | 5962-8961406MXC vs NM27C010Q120 |
| UPD27C1000AD-12 | UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | NEC Electronics Group | 5962-8961406MXC vs UPD27C1000AD-12 |
| M27C1001-15F6X | 128KX8 UVPROM, 120ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | STMicroelectronics | 5962-8961406MXC vs M27C1001-15F6X |
| HN27C301AG-12 | 128KX8 UVPROM, 120ns, CDIP32, 0.600 INCH, CERDIP-32 | Renesas Electronics Corporation | 5962-8961406MXC vs HN27C301AG-12 |
| M27C1001-12XF6 | 128KX8 UVPROM, 120ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 | STMicroelectronics | 5962-8961406MXC vs M27C1001-12XF6 |