5962-8866209NA by:

Standard SRAM, 32KX8, 12ns, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for 5962-8866209NA by QP Semiconductor

Overview of 5962-8866209NA by QP Semiconductor

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Renewable Energy Telecommunications Automotive

Part Details for 5962-8866209NA

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5962-8866209NA Part Data Attributes:

5962-8866209NA QP Semiconductor
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5962-8866209NA QP Semiconductor Standard SRAM, 32KX8, 12ns, CMOS, CDIP28, CERAMIC, DIP-28
Part Life Cycle Code Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 12 ns
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 5962-8866209NA

This table gives cross-reference parts and alternative options found for 5962-8866209NA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8866209NA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8866209NX Standard SRAM, 32KX8, 12ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor 5962-8866209NA vs 5962-8866209NX
MT5C2568C-12LE/883C Standard SRAM, 32KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Micross Components 5962-8866209NA vs MT5C2568C-12LE/883C
Part Number Description Manufacturer Compare
MB84256A-70LPSK 32KX8 STANDARD SRAM, 70ns, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 FUJITSU Limited 5962-8866209NA vs MB84256A-70LPSK
MB84256A-10LPSK 32KX8 STANDARD SRAM, 100ns, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 FUJITSU Limited 5962-8866209NA vs MB84256A-10LPSK
DPS32M8ANL-45I Standard SRAM, 32KX8, 45ns, CMOS, CDIP28, SIDE BRAZED, DIP-28 B&B Electronics Manufacturing Company 5962-8866209NA vs DPS32M8ANL-45I
HM65256BP-10 32KX8 PSEUDO STATIC RAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Renesas Electronics Corporation 5962-8866209NA vs HM65256BP-10
HM65256ASP-20 Pseudo Static RAM, 32KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Hitachi Ltd 5962-8866209NA vs HM65256ASP-20
U635H256D1C25 Non-Volatile SRAM, 32KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI 5962-8866209NA vs U635H256D1C25
U634H256DC35G1 Non-Volatile SRAM, 32KX8, 35ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 ZMDI 5962-8866209NA vs U634H256DC35G1
DPS32M8ANS-45B Standard SRAM, 32KX8, 45ns, CMOS, CDIP28, SIDE BRAZED, DIP-28 B&B Electronics Manufacturing Company 5962-8866209NA vs DPS32M8ANS-45B
U634H256BDC25 Non-Volatile SRAM, 32KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 ZMDI 5962-8866209NA vs U634H256BDC25
DPS32M8AS-25M Standard SRAM, 32KX8, 25ns, CMOS, CDIP28, CERDIP-28 B&B Electronics Manufacturing Company 5962-8866209NA vs DPS32M8AS-25M

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