Part Details for 5962-8863603LX by Teledyne e2v
Overview of 5962-8863603LX by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-8863603LX
5962-8863603LX CAD Models
5962-8863603LX Part Data Attributes
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5962-8863603LX
Teledyne e2v
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5962-8863603LX
Teledyne e2v
OTP ROM, 1KX8, 20ns, CMOS, CDIP24, CERAMIC, DIP-24
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Part Life Cycle Code | Active | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 24 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 45 ns | |
JESD-30 Code | R-GDIP-T24 | |
Memory Density | 262144 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 1024 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 | |
Supply Current-Max | 0.125 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |
Alternate Parts for 5962-8863603LX
This table gives cross-reference parts and alternative options found for 5962-8863603LX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8863603LX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
MB7232RA-20Z | FUJITSU Semiconductor Limited | Check for Price | OTP ROM, 1KX8, 20ns, Bipolar, CDIP24, CERDIP-24 | 5962-8863603LX vs MB7232RA-20Z |
MB7232RS-20Z | FUJITSU Semiconductor Limited | Check for Price | OTP ROM, 1KX8, 20ns, Bipolar, CDIP24, CERDIP-24 | 5962-8863603LX vs MB7232RS-20Z |
CY7C235A-40PI | Cypress Semiconductor | Check for Price | OTP ROM, 1KX8, 20ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | 5962-8863603LX vs CY7C235A-40PI |
AM27S37APCB | AMD | Check for Price | OTP ROM, 1KX8, 20ns, Bipolar, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | 5962-8863603LX vs AM27S37APCB |
CY7C235A-40DI | Cypress Semiconductor | Check for Price | OTP ROM, 1KX8, 20ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | 5962-8863603LX vs CY7C235A-40DI |
CY7C235-40PI | Cypress Semiconductor | Check for Price | OTP ROM, 1KX8, 20ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | 5962-8863603LX vs CY7C235-40PI |
AM27S37ADCB | AMD | Check for Price | OTP ROM, 1KX8, 20ns, Bipolar, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | 5962-8863603LX vs AM27S37ADCB |