Part Details for 5962-8863603LA by Teledyne e2v
Overview of 5962-8863603LA by Teledyne e2v
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Electronic Manufacturing
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Price & Stock for 5962-8863603LA
| Part # | Distributor | Description | Stock | Price | Buy | |
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Teledyne e2v | PROM, 1K X 8, REGISTERED, 40 NS Lead time: 14 Weeks, 0 Days | 0 |
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RFQ |
Part Details for 5962-8863603LA
5962-8863603LA CAD Models
5962-8863603LA Part Data Attributes
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5962-8863603LA
Teledyne e2v
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5962-8863603LA
Teledyne e2v
OTP ROM, 1KX8, 60ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP24,.3 | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 60 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 31.877 mm | |
| Memory Density | 8192 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 1KX8 | |
| Output Characteristics | REGISTERED | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.12 A | |
| Supply Current-Max | 0.12 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for 5962-8863603LA
This table gives cross-reference parts and alternative options found for 5962-8863603LA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8863603LA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C235A-40PI | OTP ROM, 1KX8, 20ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | Cypress Semiconductor | 5962-8863603LA vs CY7C235A-40PI |
| AM27S37APCB | OTP ROM, 1KX8, 20ns, Bipolar, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | AMD | 5962-8863603LA vs AM27S37APCB |
| CY7C235A-40DC | OTP ROM, 1KX8, 20ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | Cypress Semiconductor | 5962-8863603LA vs CY7C235A-40DC |
| 53RS881ANS | OTP ROM, 1KX8, 20ns, MOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | AMD | 5962-8863603LA vs 53RS881ANS |
| CY7C235A-40DMB | OTP ROM, 1KX8, 20ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | 5962-8863603LA vs CY7C235A-40DMB |
| MB7232RS-20Z | OTP ROM, 1KX8, 20ns, Bipolar, CDIP24, CERDIP-24 | FUJITSU Semiconductor Limited | 5962-8863603LA vs MB7232RS-20Z |
| CY7C235A-40PC | OTP ROM, 1KX8, 20ns, CMOS, PDIP24, 0.300 INCH, DIP-24 | Cypress Semiconductor | 5962-8863603LA vs CY7C235A-40PC |
| 5962-8863603LX | OTP ROM, 1KX8, 20ns, CMOS, CDIP24, CERAMIC, DIP-24 | Cypress Semiconductor | 5962-8863603LA vs 5962-8863603LX |
| CY7C235-40PI | OTP ROM, 1KX8, 20ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | Cypress Semiconductor | 5962-8863603LA vs CY7C235-40PI |
| AM27S37ADCB | OTP ROM, 1KX8, 20ns, Bipolar, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | AMD | 5962-8863603LA vs AM27S37ADCB |