Part Details for 5962-8766106XX by AMD
Overview of 5962-8766106XX by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 5962-8766106XX
5962-8766106XX CAD Models
5962-8766106XX Part Data Attributes
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5962-8766106XX
AMD
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5962-8766106XX
AMD
UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Length | 37.1475 mm | |
| Memory Density | 131072 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 16KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-8766106XX
This table gives cross-reference parts and alternative options found for 5962-8766106XX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8766106XX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NMC27C128BQ250 | IC 16K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | 5962-8766106XX vs NMC27C128BQ250 |
| LH57128J-25 | UVPROM, 16KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28 | Sharp Corp | 5962-8766106XX vs LH57128J-25 |
| TMS27C128-25JL | 131 072-Bit UV Erasable Programmable Read-Only Memory 28-CDIP 0 to 70 | Texas Instruments | 5962-8766106XX vs TMS27C128-25JL |
| AM27C128-255DEB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 5962-8766106XX vs AM27C128-255DEB |
| 27C128-25/J | 16K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | 5962-8766106XX vs 27C128-25/J |
| AM27C128-255DC | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 5962-8766106XX vs AM27C128-255DC |
| AM27C128-255DCB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 5962-8766106XX vs AM27C128-255DCB |
| 5962-8766106XX | 16K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Microchip Technology Inc | 5962-8766106XX vs 5962-8766106XX |
| AM27C128-250DEB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 5962-8766106XX vs AM27C128-250DEB |
| AM27C128-250DE | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 5962-8766106XX vs AM27C128-250DE |