5962-8751507LA by:

8KX8 UVPROM, 35ns, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24

Part Details for 5962-8751507LA by STMicroelectronics

Overview of 5962-8751507LA by STMicroelectronics

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Applications Consumer Electronics Environmental Monitoring Smart Cities

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-8751507LA

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5962-8751507LA Part Data Attributes

5962-8751507LA STMicroelectronics
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5962-8751507LA STMicroelectronics 8KX8 UVPROM, 35ns, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description 0.300 INCH, WINDOWED, CERDIP-24
Pin Count 24
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 35 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.877 mm
Memory Density 65536 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Standby Current-Max 0.035 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for 5962-8751507LA

This table gives cross-reference parts and alternative options found for 5962-8751507LA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8751507LA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8751508JX UVPROM, 8KX8, 35ns, CMOS, CDIP24, Teledyne e2v 5962-8751507LA vs 5962-8751508JX
5962-8751507LX UVPROM, 8KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc 5962-8751507LA vs 5962-8751507LX
5962-8751507LX 8KX8 UVPROM, 35ns, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 STMicroelectronics 5962-8751507LA vs 5962-8751507LX
5962-8751507LX UVPROM, 8KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8751507LA vs 5962-8751507LX
5962-8751507LA UVPROM, 8KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc 5962-8751507LA vs 5962-8751507LA
5962-8751507LX UVPROM, 8KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v 5962-8751507LA vs 5962-8751507LX
5962-8751508LX UVPROM, 8KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8751507LA vs 5962-8751508LX
CY7C264-35WI UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-8751507LA vs CY7C264-35WI
Part Number Description Manufacturer Compare
5962-8751504LA 8KX8 UVPROM, 90ns, CDIP24, CERAMIC, DIP-24 STMicroelectronics 5962-8751507LA vs 5962-8751504LA
5962-8751501LA UVPROM, 8KX8, 45ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Atmel Corporation 5962-8751507LA vs 5962-8751501LA
5962-8751503LA UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Atmel Corporation 5962-8751507LA vs 5962-8751503LA
PY26325WM UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Pyramid Semiconductor Corporation 5962-8751507LA vs PY26325WM
AM27C49-45DCB UVPROM, 8KX8, 45ns, CMOS, CDIP24, WINDOWED, CERAMIC, DIP-24 AMD 5962-8751507LA vs AM27C49-45DCB
5962-8751508LX UVPROM, 8KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8751507LA vs 5962-8751508LX
MCM68764C-35 8K X 8 UVPROM, 350 ns, CDIP24, FRIT SEALED, CERAMIC, DIP-24 Motorola Mobility LLC 5962-8751507LA vs MCM68764C-35
PY26335WM UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Pyramid Semiconductor Corporation 5962-8751507LA vs PY26335WM
AM27C49-35DC UVPROM, 8KX8, 35ns, CMOS, CDIP24, WINDOWED, CERAMIC, DIP-24 AMD 5962-8751507LA vs AM27C49-35DC
5962-8751512LA UVPROM, 8KX8, 25ns, CMOS, 0.300 INCH, WINDOWED, CERDIP-24 Defense Logistics Agency 5962-8751507LA vs 5962-8751512LA

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