Part Details for 5962-8606312QXX by Teledyne e2v
Overview of 5962-8606312QXX by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-8606312QXX
5962-8606312QXX CAD Models
5962-8606312QXX Part Data Attributes
|
|
5962-8606312QXX
Teledyne e2v
Buy Now
|
Compare Parts:
5962-8606312QXX
Teledyne e2v
UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38535 Class Q | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 5962-8606312QXX
This table gives cross-reference parts and alternative options found for 5962-8606312QXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606312QXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 27C256MQ7B/Y25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 5962-8606312QXX vs 27C256MQ7B/Y25 |
| DM27C256-25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28 | LSI Corporation | 5962-8606312QXX vs DM27C256-25 |
| 8411102YX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Intel Corporation | 5962-8606312QXX vs 8411102YX |
| 5962-8606312XA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8606312QXX vs 5962-8606312XA |
| 27C256MQ25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8606312QXX vs 27C256MQ25 |
| 5962-8606302XX | 32KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | 5962-8606312QXX vs 5962-8606302XX |
| 5962-8606312QXX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cypress Semiconductor | 5962-8606312QXX vs 5962-8606312QXX |
| 27C256MQB/C25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 5962-8606312QXX vs 27C256MQB/C25 |
| 5962-8606302XX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Intel Corporation | 5962-8606312QXX vs 5962-8606302XX |
| M38510/22401BYX | UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28 | Intel Corporation | 5962-8606312QXX vs M38510/22401BYX |